ChipMOS TECHNOLOGIES INC. ("ChipMOS"), listed on the Taiwan Stock Exchange Market in April, 2014 (TWSE: 8150), is a leading independent provider of total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. We provide a full range of back-end testing services for high density memory, mixed-signal and flat panel display (FPD) driver semiconductors. In addition, we offer a comprehensive selection of leadframe-based and organic substrate-based package assembly services for memory, mixed-signal, and FPD driver semiconductors which are used in diverse end-use markets, including personal computers, communications equipment, office automation and consumer electronics. Our testing and packaging services are provided, pursuant to customerâs request, on a independent or a turnkey basis.
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